相关实验视频

Updated: Jul 16, 2026

Nanofabrication of Gate-defined GaAs/AlGaAs Lateral Quantum Dots
15:47

Nanofabrication of Gate-defined GaAs/AlGaAs Lateral Quantum Dots

Published on: November 2, 2013

超薄金属层的选择性沉积策略在亚微米-Pitch Cu互连上用于低温混合结合的低温结合

Zambaga Otgonbayar1, Jungchul Noh2, Seong-Ho Yoon3,4

  • 1Department of Polymer Science and Engineering Inha University 100 Inha-ro, Michuhol-gu Incheon 22212 Korea.

Small science
|February 20, 2026
PubMed
概括

本研究介绍了一种使用无电沉积 (ELD) 进行先进半导体包装的低温混合粘合技术. 这种方法可以在250°C下实现强大的铜互连,克服了高温工艺的局限性.

关键词:
铜铜金属结合物 铜铜金属结合物先进的包装,先进的包装.没有电力的沉积沉积.混合型债券是一种混合型债券.低温粘合的结合方式

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Colloidal precipitates01:09

Colloidal precipitates

The high insolubility of some precipitates can result in an unfavorable relative supersaturation. This can lead to colloidal particles with a large surface-to-mass ratio, where adsorption is promoted. For instance, in the precipitation of silver chloride, silver ions are adsorbed on the surface of the colloidal particles, forming a primary layer. This layer attracts ions of opposite charge (such as nitrate ions), forming a diffuse secondary layer of adsorbed ions. This electric double layer...