优化增强模式的MIS-GaN HEMT与双通道用于简单的过程使用TCAD模拟的优化
Kang Hee Lee1, Yeonsil Yang1, Junseok Heo2
1Department of Intelligence Semiconductor Engineering, Ajou University, Suwon, 16499, Republic of Korea.
Scientific reports
|February 25, 2026
概括
一种新的双通道化 (GaN) 高电子流动性晶体管 (HEMT) 能够实现增强模式 (E模式) 操作. 这种设计可以在没有复杂的制造过程中实现正值值电压转移,为E-mode GaN HEMTs提供了更简单的路径.
科学领域:
- 半导体物理 半导体物理
- 材料科学 材料科学 材料科学
- 设备工程 设备工程
背景情况:
- 化 (GaN) 高电子流动性晶体管 (HEMT) 对于高功率和高频应用至关重要.
- 在GaN HEMT中实现增强模式 (E模式) 操作对于简化电路设计和降低功耗至关重要.
- 目前的E模式制造方法,如入门或p-GaN门,涉及复杂而精确的加工步骤.
研究的目的:
- 展示一种新的金属绝缘体半导体 (MIS) 双通道HEMT (IDC-HEMT) 结构,以实现E模式操作.
- 研究双通道结构对晶体管的电特性,特别是值电压 (Vth) 的影响.
- 为了确认E模式操作的可行性,而无需使用复杂的制造技术.
主要方法:
- 使用Synopsys SentaurusTM技术计算机辅助设计 (TCAD) 模拟器进行设备建模和模拟.
- 设计一个带有两个AlGaN/GaN异质连接层的双通道结构,形成两个独立的二维电子气体 (2DEG) 层.
- 在双通道结构中分析电子动态和电荷分布,以了解E模式操作的机制.
主要成果:
- 拟议的MIS双通道HEMT (IDC-HEMT) 成功实现了E模式运行,值电压 (Vth) 为0.25V,与单通道设备相比,1.66V的显著正位移.
- 测量了2DEG板密度:5.49 × 10^12 cm^-2 (上通道,单通道HEMT),3.43 × 10^12 cm^-2 (上通道,双通道HEMT) 和0.76 × 10^12 cm^-2 (下通道,双通道HEMT).
- 与单通道HEMT的22.7 Ω·mm相比,IDC-HEMT的点电阻 (R_on) 略有增加,为28.7 Ω·mm,这归因于上通道2DEG密度降低.
结论:
- 双通道结构有效地诱导负偏移体效应,使得E模式操作的门电压发生正转变.
- 这种IDC-HEMT设计为实现E模式GaN HEMT提供了可行的替代方案,避免了复杂的蚀刻过程的需要.
- 结果证实了双通道方法在开发更简单,更高效的E模式GaN电源设备方面的潜力.
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