虚拟化作为半导体设备超越几何缩放的新缩放规律
Zeheng Wang1, Xinghuan Chen2, Fanfan Lin3
1Manufacturing, CSIRO, Sydney, NSW, Australia.
Small (Weinheim an der Bergstrasse, Germany)
|February 26, 2026
概括
人工智能 (AI) 实现了虚拟化,这是半导体进步的新扩展规律. 可信的虚拟证据现在可以取代广泛的物理过程,克服摩尔定律的局限性.
科学领域:
- 半导体制造业 半导体制造业
- 材料科学是一种材料科学.
- 人工智能的人工智能是人工智能.
背景情况:
- 摩尔定律正在接近物理和经济的极限.
- 传统的半导体开发主要依赖于昂贵且耗时的物理代 (制造,测试,合格).
研究的目的:
- 通过虚拟化提出人工智能 (AI) 作为半导体进步的补充缩放规律.
- 探索可靠的虚拟证据如何可以在半导体设备生命周期中取代物理过程.
主要方法:
- 设计和建模中的虚拟化使用代用和物理信息学习,反向设计和不确定性意识探索.
- 在制造和包装领域的虚拟化利用数字双胞胎,虚拟计量学和强化学习.
- 通过缺陷推断和可靠性建模进行资格化的虚拟化,用于早期风险检测.
主要成果:
- 人工智能驱动的虚拟化为超越几何界限的半导体扩展提供了一个新的途径.
- 虚拟证据,当值得信赖时,可以显著减少对物理制造,测试和资格的需求.
- 为半导体生命周期的每个阶段确定了特定的AI技术,以实现虚拟化.
结论:
- 未来的半导体创新取决于虚拟证据的忠实性,集成和管理,补充传统的几何缩放.
- 建立信任,管理不确定性,确保跨阶段的连贯性,以及解决可持续性和治理是成功虚拟化的关键边界条件.
- 人工智能驱动的虚拟化代表了范式的转变,使半导体开发更加高效和可持续.
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