TCAD模拟STI深度和SiO2/接口陷调制对HZO基纳米板FET中低频噪声的影响
1Department of System Semiconductor Engineering, Sangmyung University, Cheonan 31066, Republic of Korea.
Nanomaterials (Basel, Switzerland)
|February 26, 2026
概括
在纳米板场效应晶体管 (NSFET) 中优化浅沟隔离深度和接口陷可显著降低低频噪声. 这项研究指导了可靠的低功耗逻辑设备的开发.
科学领域:
- 半导体设备物理学的物理
- 材料科学是一种材料科学.
- 纳米电子学纳米电子学
背景情况:
- 纳米板场效应晶体管 (NSFET) 中的低频噪声会影响设备的可靠性.
- 浅沟隔离 (STI) 和门绝缘体性能是影响噪声的关键因素.
研究的目的:
- 分析NSFET的低频噪声特征.
- 调查STI深度和接口陷密度对闪噪声的影响.
- 为了优化NSFET设计以减少噪音.
主要方法:
- 技术计算机辅助设计 (TCAD) 模拟被使用.
- 系统评估STI深度和门绝缘器接口陷密度对噪声功率光谱密度 (PSD) 的影响.
- 对HfO2-ZrO2 (HZO) 铁电绝缘体与HfO2进行比较.
主要成果:
- 增加STI深度会导致由于寄生式晶体管效应导致更高的闪噪声.
- 浅浅的STI结构具有较低的被困电荷密度.
- 与HfO2相比,HZO铁电绝缘器可以改善门控制并减少噪声.
- 在3纳米的STI深度和1×10 eV-1cm-2SiO/接口陷密度达到最佳噪声性能.
结论:
- 结构和材料的优化是低噪音NSFET的关键.
- STI 深度和接口陷管理对于设备性能至关重要.
- 这项工作为下一代低功耗,高可靠性逻辑设备提供了设计路线图.
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