,Cu/a-SiO2

Yufan Li1, Linmao Song1, Jun Lyu1

  • 1School of Advanced Manufacturing and Robotics, Peking University, Beijing 100871, P. R. China.

Nano letters
|February 26, 2026
PubMed
概括

在3D集成电路中的接口热导率受到孔隙和光原子的阻碍. 了解它们的综合作用对于先进电子产品的有效散热至关重要.