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模拟和实验研究单晶多粒钻石切割的模拟和实验研究

Guofu Luo^1,2, Shuo Sun¹, Liwei Li¹

¹Henan Provincial Key Laboratory of Intelligent Manufacturing of High-End Equipment, Zhengzhou University of Light Industry, Zhengzhou 450002, China.

|February 27, 2026

概括

为晶片优化钻石丝,大大降低了切削力和剩余应力. 这项研究揭示了磨砂间距和高度是高效单晶晶圆的关键因素.

科学领域:

材料科学材料科学材料科学
机械工程机械工程
半导体制造业半导体制造业

背景情况:

钻石丝对于光伏和微电子行业高效的单晶晶片生产至关重要.
了解磨料切割机制对于优化晶圆质量和减少材料损失至关重要.

研究的目的:

调查磨砂剂颗粒间距和高度差异对单晶晶圆的影响.
分析对表面形态,切削力和残余应力的影响.
为了优化切割参数,减少切割力和残余应力.

主要方法:

使用约翰逊-霍尔姆奎斯特-II (JH-II) 构成模型进行显式有限元素动力学模拟.
开发一个高精度的三维有限元素模型.
应用多因素直角实验设计进行参数优化.

主要成果:

磨砂颗粒间距和高度显著影响到颗粒合,峰值切削力和伤表面损伤.
拟议的算法优化方案有效地解决了切削力和残余应力.
确定了最佳参数 (U=1385 m/min,V=142°,W=6.2 μm) 的情况.

结论:

该研究成功地确定了单晶的最佳钻石丝参数.
实现了33%的剩余应力降低和75%的切削力降低.
提供了提高晶片制造效率和质量的途径.

关键词:

切割力是指切割的力量.钻石砂是钻石砂中的一个.一个晶体的单晶.表面形态学表面形态学表面的粗度表面的粗度

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