基于玻璃的半模SIW带通波器,具有负合结构.
Chen Shi1, Wenlei Li1,2, Jihua Zhang1,2
13D Chips (Guangdong) Technology Co., Ltd., Dongguan 523808, China.
Micromachines
|February 27, 2026
概括
这项研究引入了一种新的毫米波过器,使用玻璃技术实现高选择性. 新设计能够精确控制信号合,这对于先进的通信系统至关重要.
科学领域:
- 电气工程 电气工程
- 电磁学 电磁学 电磁学 电磁学
- 微波工程 微波工程
背景情况:
- 基板集成波导 (SIW) 技术在微波电路的小型化和集成方面具有优势.
- 传统的印刷电路板 (PCB) 的局限性阻碍了SIW在更高频率的运行.
- 在毫米波频率下,实现高选择性和特定的过器响应 (如准圆函数) 是具有挑战性的.
研究的目的:
- 提出一种新的毫米波半模式基质集成波导 (HMSIW) 波器.
- 引入负合结构以实现准圆函数响应.
- 为了证明透过玻璃通过 (TGV) 技术对高频SIW应用的有效性.
主要方法:
- 设计和模拟用于HMSIW腔的新型负合结构.
- 研究合机制及其对传输零点的影响.
- 使用基于玻璃的TGV技术制造和测量第四阶段带宽过渡波器原型.
主要成果:
- 拟议的负合结构允许灵活调整HMSIW腔间的合.
- 制造过器表现出良好的匹配,并验证了拟议的拓.
- 基于玻璃的工艺使得与传统PCB相比,运行频率更高.
结论:
- 开发的基于玻璃的负合结构对于实现具有准圆反应的SIW过器是有效的.
- 该TGV技术适用于高精度SIW过器在毫米波频率的制造.
- 这种方法对毫米波应用中先进的过器设计有希望.
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