基于的芯片集成红外光探测器的近期进展
Yu He1,2, Hongling Peng1, Peng Cao1
1Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
Sensors (Basel, Switzerland)
|February 27, 2026
概括
基于的红外光探测器为先进的传感提供了经济高效的小型化解决方案. 本综述涵盖了下一代光电子产品的IV,III-V组和2D材料.
科学领域:
- 光电学和光子学的光电子和光子学.
- 材料科学 材料科学 材料科学
- 半导体设备 半导体设备
背景情况:
- 红外 (IR) 光探测器对于各种应用至关重要,但面临诸如高成本和庞大的冷却要求等局限性.
- 传统的散装半导体探测器阻碍了对尺寸,重量和功率 (SWaP) 敏感的应用.
- 基于与CMOS过程的集成为小型化,经济高效的光子集成电路 (PIC) 提供了一条道路.
研究的目的:
- 审查基于的红外光探测器的最新进展.
- 探索第四组 (Ge/GeSn),第三-五组和二维材料系统的进展情况.
- 通过光电子融合,提供未来智能传感系统的前景.
主要方法:
- 关于基于的红外光探测器的当前文献和研究的综述.
- 对材料系统的分析,包括IV,III-V组化合物和二维材料.
- 讨论与CMOS技术的集成,用于芯片上传感和数据传输.
主要成果:
- 在开发基于的红外光探测器方面取得了重大进展.
- 不同的材料系统 (Ge/GeSn,III-V,2D) 对特定的红外探测需求显示出希望.
- 在芯片上集成使微型光电子系统的功能提升成为可能.
结论:
- 基于的红外光探测器是克服传统探测器局限性的关键技术.
- 材料科学和整合的持续发展将推动下一代智能传感系统的创建.
- 光电子融合正在为先进,紧,高效的红外传感解决方案铺平道路.
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