通过直接集成多种光纤/3D/2D芯片混合集成,实现通用多维并行通信
Kang Li1,2,3, Chengkun Cai1,2,3, Guofeng Yan1,2,3
1Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.
Nature communications
|March 11, 2026
概括
空间分割复杂化 (SDM) 能够实现更高的光纤容量. 这项研究将光纤和芯片技术集成为无模式转换,实现跨多种光纤类型的30 Tbit/s传输.
科学领域:
- 光电学是指光电子产品.
- 光子学 是一个光子学.
- 电信 电信服务 电信服务 电信服务
背景情况:
- 空间分割复杂化 (SDM) 对于增加光纤容量至关重要.
- 现有的SDM技术包括少数模式纤维 (FMF),多核纤维 (MCF) 和轨道角动量纤维 (OAMF).
- 将SDM纤维与光子集成电路集成,面临着模式场不匹配的挑战.
研究的目的:
- 开发光纤芯片合器,以实现无的模式-场转换.
- 构建一个与各种SDM光纤类型兼容的光纤-芯片-光纤系统.
- 为了展示一个高容量,多维的并行通信架构.
主要方法:
- 纤维,3D和2D芯片的混合集成,以创建多样化的纤维芯片合器.
- 开发大型的多功能2D芯片,用于系统集成.
- 构建一个支持FMF,MCF,OAMF和单模纤维的光纤芯片光纤系统.
主要成果:
- 在纤维和芯片之间实现了无的模式场转换.
- 成功地将各种SDM纤维与2D光子芯片集成.
- 展示了一个具有288个通道 (8个空间模式x36个波长) 的并行通信系统.
- 实现了30 Tbit/s的数据传输能力.
结论:
- 建立了一个通用的多维并行化通信架构.
- 为下一代多维数据传输和管理铺平了道路.
- 克服了可扩展SDM系统的光纤芯片兼容性挑战.
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