在多晶Al/Mg双金属系统的固体-液体界面上的扩散行为和断裂机制:分子动力学模拟
Xiaoqiong Wang1, Jingfan Cheng2, Guangyu Li1
1School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China.
Materials (Basel, Switzerland)
|March 14, 2026
概括
分子动力学模拟揭示了倒和预热温度如何影响Al/Mg双金属复合材料. 高温增加扩散和界面层厚度,影响断裂机制并优化拉伸强度.
科学领域:
- 材料科学 材料科学 材料科学
- 计算材料科学科学 计算材料科学
- 金工业是金工业的一个方面.
背景情况:
- 在航空航天和汽车工业的轻量化应用中,Al/Mg双金属复合材料至关重要.
- 接口行为是这些复合材料性能和可靠性的关键.
研究的目的:
- 通过分子动力学模拟,研究灌和预热温度对Al/Mg双金属系统的界面扩散和断裂机制的影响.
- 确定最佳的制备参数,以提高材料性能.
主要方法:
- 进行了分子动力学 (MD) 模拟.
- 灌温度 (923 K, 973 K, 1023 K) 和预热温度 (373 K, 473 K, 573 K) 的系统变化.
- 对界面扩散行为和拉伸断裂机制的分析.
主要成果:
- 倒和预热温度始终影响界面扩散;Mg扩散系数高于Al,而Al扩散距离更大.
- 温度上升导致一个更厚的界面过渡层.
- 倒温度会影响断裂模式 (由位移介导到位移双胞胎),而预热温度不会改变位移控制的机制.
- 断裂始终发生在扩散层和Mg矩阵之间的接口上.
- 在923K的倒和473K的预热温度下达到1.850GPa的最佳拉伸强度,提高了52%.
结论:
- 温度参数显著影响Al/Mg系统中的界面扩散和断裂行为.
- 了解这些关系可以合理优化准备参数.
- 这项研究提供了对Al/Mg双金属系统断裂机制的理论见解.
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