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Updated: Mar 15, 2026

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在铜电子沉积中,表面粗度和晶体定向之间的权衡通过高度的凝来进行沉积

Yitao Zheng1, Peng Xu1, Jingsha Tan1

  • 1School of Chemical Engineering and Technology, Sun Yat-sen University, Zhuhai 519082, China.

Materials (Basel, Switzerland)
|March 14, 2026
PubMed
概括

为了实现5G/6G的光滑, (111) 导向的铜很难. 将凝添加到电沉积添加剂中会产生"高N/低D"模式,显著降低粗度,但随机化晶体方向.

关键词:
在HVLP中使用铜.铜电极的位置是铜电极.结晶学纹理 结晶学纹理这是一种凝凝.高频应用 高频应用核化动力学 核化动力学超低粗度 超低粗度 超低粗度

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Electrodeposition01:08

Electrodeposition

Electrodeposition is a technique used to separate an analyte from interferents by electrochemical processes. Here, the analyte is a metal ion that can be deposited on an electrode immersed in the sample solution. The electrochemical setup consists of an anode and a cathode. When an electric current is applied to the setup, oxidation occurs at the anode. At the cathode, which consists of a large metal surface, metal ions undergo reduction and deposit onto the surface.
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