在室温CMOS电路中使用纳米基氧化物的in-situ p-doping
Mengfei He1, Hamin Choi2, Zhikai Le1
1Institute of Fundamental and Frontier Sciences, State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China.
Advanced materials (Deerfield Beach, Fla.)
|March 17, 2026
概括
研究人员开发了一种用于氧化的新方法,创造了高性能的p型氧化物半导体. 这一突破使得在室温下制造用于灵活电子的全氧化物互补金属氧化物半导体 (CMOS) 电路成为可能.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 纳米技术纳米技术
背景情况:
- 开发高性能p型氧化物半导体对于可扩展的互补金属氧化物半导体 (CMOS) 技术至关重要.
- 传统的氧化物在p型兴奋剂中存在挑战,原因是局部化的氧轨道和缺陷补偿.
研究的目的:
- 报告一种新的反应金属介导的氧化还原策略,用于氧化物的固有 in situ p 型兴奋剂.
- 为了克服先进的半导体应用中传统的p型氧化物兴奋剂的局限性.
主要方法:
- 在薄膜沉积过程中使用了 (Mo) 辅助的减少策略.
- 利用沉积环境对氧化进行内在的兴奋剂.
- 制造的纳米 Te 基氧化物薄膜具有可调节的 Te 纳米通道.
主要成果:
- 通过Te纳米通道形成的透通道实现了洞运输的显著增强.
- 经过证明的薄膜在室温 (RT) 沉积的移动性超过10 cm2 V-1 s-1.1.
- 调整的载体密度超过五个数量级.
- 成功与n型氧化物晶体管联合集成,在RT上创建全氧化物CMOS电路.
结论:
- 反应金属介导的氧化还原策略为克服p型氧化物中兴奋剂瓶提供了一条可通用的途径.
- 这种方法推进了用于大面积,灵活的CMOS电子的氧化物半导体.
- 允许在室温下完全制造功能性的全氧化物CMOS电路.
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