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Evaluation of the F2000 bonding procedure: a high resolution SEM study
L Breschi1, P Gobbi, M Falconi
1Istituto di Anatomia Umana, University of Bologna, Bologna, Italy. lbreschi@biocfarm.unibo.it
Journal of Dentistry
|January 26, 2002
Summary
The F2000 Restorative System shows good ultra-structural bonding to enamel and dentin. However, the Scotchbond 1 (SB1) adhesive system achieved significantly higher bond strength in this study.
Area of Science:
- Dental Materials Science
- Biomaterials Engineering
- Adhesive Dentistry
Background:
- Dental restorative systems require effective bonding to tooth structure for longevity.
- Understanding the morphological characteristics of adhesive interfaces is crucial for predicting clinical performance.
- The F2000 Restorative System utilizes a one-step approach, while Scotchbond 1 (SB1) employs a multi-step total-etch technique.
Purpose of the Study:
- To evaluate the morphological bonding of the F2000 Restorative System to enamel and dentin using high-resolution scanning electron microscopy (SEM).
- To correlate SEM findings with tensile bond strength analysis.
- To compare the bonding performance of F2000 with a control adhesive system, Scotchbond 1 (SB1).
Main Methods:
- Teeth were prepared using F2000 PA (15s and 30s) or 35% phosphoric acid with SB1 (15s and 30s).
- Restored teeth were extracted, sectioned, and analyzed via field emission in-lens SEM (FEISEM).
- In vitro evaluation of conditioning/etching patterns on dentin disks was performed.
Main Results:
- FEISEM revealed microporosities and good resin adaptation on enamel after 30s F2000 PA application.
- F2000 PA application on dentin showed residual smear plugs, unlike the complete absence after phosphoric acid etching.
- SB1 demonstrated open tubules and resin tag formation, indicating effective etching.
Conclusions:
- The F2000 PA one-step procedure showed favorable ultra-structural bonding to enamel and dentin at 30s.
- The SB1 adhesive system, following phosphoric acid etching, yielded significantly higher bond strength values (19.0+/-4.4MPa) compared to F2000 PA (7.7+/-2.2MPa).
- While morphologically adequate, the F2000 system's bond strength was surpassed by the SB1 system.