Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Capacitor With A Dielectric01:18

Capacitor With A Dielectric

Parallel plate capacitors consist of two conducting plates separated by a certain distance. However, it is mechanically difficult to hold the large plates parallel to each other without actual contact. Hence, a dielectric layer is commonly placed between the plates, which provides an easy solution for holding the plates together with a small gap and increases the capacitance of the capacitor.
Dielectrics are non-conducting materials with no free or loosely bound electrons. When a dielectric is...

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Spontaneous cephalic oscillations in vertebrate embryos support the Inside Story scenario of human development and evolution.

Scientific reports·2026
Same author

Are Dual-Phase <sup>18</sup>F-Fluorodeoxyglucose PET-mpMRI Diagnostic Performances to Distinguish Brain Tumour Radionecrosis/Recurrence after Cranial Radiotherapy Usable in Routine?

Cancers·2024
Same author

Electrical stimulation of chicken embryo development supports the Inside story scenario of human development and evolution.

Scientific reports·2024
Same author

Genetic determinism and hemispheric influence in hair whorl formation.

Journal of stomatology, oral and maxillofacial surgery·2023
Same author

Prospective Multicentric Assessment of <sup>68</sup>Ga-DOTANOC PET/CT in Grade 1-2 GEP-NET.

Cancers·2023
Same author

Dynamics of early stages of nose morphogenesis.

The European physical journal. E, Soft matter·2022

Related Experiment Video

Updated: Jul 16, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Rapid electroplating of insulators.

Vincent Fleury1, Wesley A Watters, Levy Allam

  • 1Laboratoire de Physique de la Matière Condensée, Ecole Polytechnique/CNRS, 91128 Palaiseau cedex, France. vincent.fleury@polytechnique.fr

Nature
|April 19, 2002
PubMed
Summary

A novel electroplating method enables metal coating of insulating materials with controlled thickness and grain size. This technique overcomes previous limitations, allowing for uniform film formation on non-conductive surfaces.

More Related Videos

Electrospinning of Photocatalytic Electrodes for Dye-sensitized Solar Cells
09:30

Electrospinning of Photocatalytic Electrodes for Dye-sensitized Solar Cells

Published on: June 28, 2017

Experimental Implementation of a New Composite Fabrication Method: Exposing Bare Fibers on the Composite Surface by the Soft Layer Method
06:26

Experimental Implementation of a New Composite Fabrication Method: Exposing Bare Fibers on the Composite Surface by the Soft Layer Method

Published on: October 6, 2017

Related Experiment Videos

Last Updated: Jul 16, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Electrospinning of Photocatalytic Electrodes for Dye-sensitized Solar Cells
09:30

Electrospinning of Photocatalytic Electrodes for Dye-sensitized Solar Cells

Published on: June 28, 2017

Experimental Implementation of a New Composite Fabrication Method: Exposing Bare Fibers on the Composite Surface by the Soft Layer Method
06:26

Experimental Implementation of a New Composite Fabrication Method: Exposing Bare Fibers on the Composite Surface by the Soft Layer Method

Published on: October 6, 2017

Area of Science:

  • Materials Science
  • Electrochemistry
  • Surface Engineering

Background:

  • Electrochemical deposition methods for metal films are historically significant.
  • Traditional methods include spontaneous redox reactions (limited control) and electroplating (restricted to conductive substrates).
  • Existing techniques face challenges in controlling deposition conditions and substrate compatibility.

Purpose of the Study:

  • To develop an electroplating technique for coating insulating substrates with metals.
  • To achieve controlled grain size, thickness, and growth speed during deposition.
  • To overcome the substrate conductivity limitation of conventional electroplating.

Main Methods:

  • Utilized an electroplating approach with a specific cell geometry.
  • Employed progressive outward growth of metal from an electrode in contact with the substrate.
  • Optimized conditions to ensure electron current passes through the growing deposit.

Main Results:

  • Successfully coated insulating substrates with metal films using electroplating.
  • Achieved controlled metal film properties including grain size, thickness, and growth speed.
  • Identified specific conditions that promote rapid, uniform film formation, avoiding dendritic or powdery deposits.

Conclusions:

  • The developed electroplating technique expands the applicability of electroplating to insulating materials.
  • Offers precise control over metal film characteristics on diverse substrates.
  • Paves the way for new applications in microelectronics, catalysis, and protective coatings.