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Related Experiment Videos

Automatic integrated circuit die positioning in the scanning electron microscope.

H W Tan1, J C H Phang, J T L Thong

  • 1Centre for Integrated Circuit Failure Analysis and Reliability (CICFAR), Faculty of Engineering, National University of Singapore.

Scanning
|May 10, 2002
PubMed
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This study introduces an automated vision-based system for locating failure sites in integrated circuits (ICs) using scanning electron microscopy (SEM). The new system significantly reduces the time and effort required for failure analysis, improving efficiency.

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Computer Vision

Background:

  • Manual failure site localization in scanning electron microscope (SEM) based integrated circuit (IC) failure analysis is time-consuming.
  • Existing methods often require high-accuracy specimen stages, adding complexity and cost.

Purpose of the Study:

  • To develop an automated vision-based die positioning system for accurate failure site localization in ICs.
  • To eliminate the need for high-accuracy specimen stages in SEM-based failure analysis.

Main Methods:

  • The system utilizes either image registration or feature tracking algorithms to identify specified failure sites.
  • It operates without requiring a high-accuracy specimen stage.

Main Results:

Related Experiment Videos

  • The vision-based system accurately locates failure sites on various IC samples.
  • The system demonstrates robustness against challenges like IC sample rotation and repetitive patterns.

Conclusions:

  • The developed system offers an efficient and accurate solution for automated failure site localization in ICs.
  • This technology streamlines the failure analysis process, making it less labor-intensive.