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Related Experiment Videos

Simple integration technique to realize parallel optical interconnects: implementation of a pluggable two-dimensional

Alain Goulet1, Makoto Naruse, Masatoshi Ishikawa

  • 1Department of Information Physics and Computing, Graduate School of Information Science and Technology, University of Tokyo, Japan. agoulet@k2.t.u-tokyo.ac.jp

Applied Optics
|September 13, 2002
PubMed
Summary

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A novel assembly technique enables pluggable optoelectronic systems using image relays. This method successfully integrated laser and photodetector arrays, achieving parallel optical interconnects at 10 MHz despite minor misalignments.

Area of Science:

  • Optoelectronics
  • Optical Engineering
  • Materials Science

Background:

  • Optoelectronic systems require precise alignment for efficient data transfer.
  • Current integration methods can be complex and costly.
  • Image relays offer a potential solution for simplified optoelectronic assembly.

Purpose of the Study:

  • To present a visual alignment and assembly technique for optoelectronic systems using image relays.
  • To demonstrate the integration of optoelectronic components with gradient index lenses.
  • To validate the performance of the assembled systems in terms of optical interconnects.

Main Methods:

  • Utilized an image relay-based assembly technique for optoelectronic integration.
  • Visually aligned and assembled optoelectronic chips and fiber bundles to relay halves.

Related Experiment Videos

  • Integrated 2D arrays of vertical-cavity surface-emitting lasers and photodetectors with fiber image guides and gradient index lenses.

    • Main Results:

    • Achieved successful parallel optical interconnects at 10 MHz.
    • Demonstrated integration within +/-0.5 mm lateral tolerances.
    • Reported average and worst-case lateral misalignments of 20 microm and 60 microm, respectively.

    Conclusions:

    • The presented assembly technique is effective for creating pluggable or fully integrated optoelectronic systems.
    • The method allows for reliable optical interconnects even with moderate lateral tolerances.
    • This approach simplifies the assembly of complex optoelectronic modules.