Development of a SAW duplexer with one-chip isolation circuits

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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

Yongrae Roh1, Seunghee Lee

  • 1School of Mechanical Engineering, Kyungpook National University, Sankyukdong 1370, Bukgu, Daegu 702-701, South Korea. yryong@knu.ac.kr

Ultrasonics
|March 30, 2004
PubMed

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