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Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization
Published on: July 5, 2016
Nanomechanical characterization of multilayered thin film structures for digital micromirror devices
Guohua Wei1, Bharat Bhushan, S Joshua Jacobs
1Nanotribology Laboratory for Information Storage and MEMS/NEMS, Department of Mechanical Engineering, Ohio State University, 206 W 18th Avenue, Columbus, OH 43210-1107, USA.
Abstract:
The digital micromirror device (DMD), used for digital projection displays, comprises a surface-micromachined array of up to 2.07 million aluminum micromirrors (14 microm square and 15 microm pitch), which switch forward and backward thousands of times per second using electrostatic attraction. The nanomechanical properties of the thin-film structures used are important to the performance of the DMD. In this paper, the nanomechanical characterization of the single and multilayered thin film structures, which are of interest in DMDs, is carried out. The hardness, Young's modulus and scratch resistance of TiN/Si, SiO2/Si, Al alloy/Si, TiN/Al alloy/Si and SiO2/TiN/Al alloy/Si thin-film structures were measured using nanoindentation and nanoscratch techniques, respectively. The residual (internal) stresses developed during the thin film growth were estimated by measuring the radius of curvature of the sample before and after deposition. To better understand the nanomechanical properties of these thin film materials, the surface and interface analysis of the samples were conducted using X-ray photoelectron spectroscopy. The nanomechanical properties of these materials are analyzed and the impact of these properties on micromirror performance is discussed.

