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Updated: Aug 19, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Quantitative transmission electron microscopy analysis of the pressure of helium-filled cracks in implanted silicon
K Tillmann1, N Hging, H Trinkaus
1Institut für Festkörperforschung, Forschungszentrum Jülich GmbH, D-52425 Jülich, Germany. k.tillmann@fz-juelich.de
Abstract:
The pressure of crack-shaped cavities formed in silicon upon implantation with helium and subsequent annealing is quantitatively determined from the measurement of diffraction contrast features visible in transmission electron micrographs taken under well-defined dynamical two-beam conditions. For this purpose, simulated images, based on the elastic displacements associated with a Griffith crack, are matched to experimental micrographs, thus yielding unambiguous quantitative data on the ratio p of the cavity pressure to the silicon matrix shear modulus. Experimental results demonstrate cavity radii of some 10 nm and p values up to 0.22, which may be regarded as sufficiently high for the emission of dislocation loops from the cracks.
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