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Updated: Aug 5, 2026

On-Chip Crystallization and Large-Scale Serial Diffraction at Room Temperature
Published on: March 11, 2022
Crystallinity estimation of thin silicon-on-insulator layers by means of diffractometry using a highly parallel X-ray
Shingo Takeda1, Kazushi Yokoyama, Yoshiyuki Tsusaka
1Japan Synchrotron Radiation Research Institute, Sayo, Hyogo 679-5198, Japan. stakeda@spring8.or.jp
Abstract:
An X-ray microbeam with a small angular divergence and a narrow energy bandwidth has been produced at BL24XU at SPring-8. The beam size was measured to be 3.1 microm and 1.6 microm in the horizontal and vertical directions, respectively, and the horizontal angular divergence was 4.0 arcsec. Using this microbeam the crystallinity estimation of thin layers on silicon-on-insulator (SOI) wafers is demonstrated. In reciprocal-space maps the lattice tilt variations were 80 arcsec and more than 220 arcsec in the SOI layers on bonded and SIMOX wafers, respectively. In equi-tilt maps, the typical equi-tilt areas of the SOI layers were 7 microm and 4 microm in size on the bonded and SIMOX wafers, respectively.
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