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Updated: Jul 15, 2026
07:37
Basic Research in Plasma Medicine - A Throughput Approach from Liquids to Cells
Published on: November 17, 2017
Low-energy linear oxygen plasma source.
André Anders1, George Yu Yushkov
1Lawrence Berkeley National Laboratory, University of California, Berkeley, CA 94720, USA. aanders@lbl.gov
The Review of Scientific Instruments
|May 5, 2007
Summary
A novel constricted plasma source with metal-ceramic construction and a linear slit exit was developed. It efficiently generates oxygen plasma with tunable ion energy, suitable for surface functionalization and film deposition.
Area of Science:
- Plasma Physics
- Materials Science
- Surface Engineering
Background:
- Constricted plasma sources are crucial for various industrial applications.
- Optimizing plasma characteristics, such as ion energy and composition, is key for enhanced performance.
- Existing sources may have limitations in power, construction, or operational flexibility.
Purpose of the Study:
- To describe and characterize a new all metal-ceramic constricted plasma source.
- To investigate the plasma properties, including ion species, current, and energy distribution.
- To evaluate the source's potential for surface modification and thin-film deposition.
Main Methods:
- Utilized a constricted plasma source with a 180 mm linear slit exit and continuous wave (cw) operation.
- Operated the source with oxygen gas at varying flow rates and frequencies (50 kHz to 200 kHz).
- Employed a combined mass spectrometer and energy analyzer to measure ion energy distribution functions.
Main Results:
- Achieved a maximum total ion current of approximately 0.5 A.
- Observed >10% atomic ions at O2 flow rates <10 SCCM and chamber pressure ~0.5 Pa.
- Demonstrated significant control over ion energy distributions (several eV to 30-90 eV) by adjusting frequency and anode potential.
Conclusions:
- The new constricted plasma source offers high performance and control over plasma parameters.
- The source's design and operational flexibility make it suitable for surface functionalization and plasma-assisted deposition.
- Potential for scalability and broader applications in materials processing.
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