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Thermally controlled fluidic self-assembly.

Ravi Sharma1

  • 1Research and Development Laboratories, Eastman Kodak Company, Rochester, New York 14650, USA. ravi.sharma@bausch.c

Langmuir : the ACS Journal of Surfaces and Colloids
|May 15, 2007
PubMed
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This study introduces thermally controlled fluidic self-assembly (TCFSA) for microparts. By heating a Pluronic F127 carrier fluid, assembly at specific sites is precisely controlled, enabling directed micropart arrangement.

Area of Science:

  • Materials Science
  • Chemical Engineering
  • Nanotechnology

Background:

  • Fluidic self-assembly (FSA) is a method for arranging microcomponents.
  • Controlling binding sites in multibatch FSA processes remains a challenge.
  • Existing methods often interfere with inherent attractive forces.

Purpose of the Study:

  • To present a novel fluidic self-assembly approach using thermal control.
  • To demonstrate a multibatch process for micropart assembly.
  • To enable directed self-assembly by controlling carrier fluid properties.

Main Methods:

  • Utilized the thermal gelation of a Pluronic F127 carrier fluid.
  • Employed capillary bridges between hydrophobic surfaces for initial assembly.
  • Prevented assembly at unheated sites by inducing carrier fluid gelation.

Related Experiment Videos

  • Demonstrated Thermally Controlled Fluidic Assembly (TCFSA) with plastic microparts.

    • Main Results:

    • Successfully demonstrated fluidic self-assembly and TCFSA of microparts.
    • Identified 15 wt % Pluronic F127 as a suitable carrier fluid, gelling around 40°C.
    • Showcased TCFSA's ability to direct assembly to specific, non-heated locations.
    • Confirmed that TCFSA restricts micropart transport rather than altering attractive forces.

    Conclusions:

    • TCFSA offers a general and effective method for directed micropart assembly.
    • The approach leverages thermal properties of the carrier fluid for site selection.
    • This technique provides a non-disruptive way to control self-assembly processes.