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Semiconductors01:22

Semiconductors

There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
Types of Semiconductors01:20

Types of Semiconductors

Intrinsic semiconductors are highly pure materials with no impurities. At absolute zero, these semiconductors behave as perfect insulators because all the valence electrons are bound, and the conduction band is empty, disallowing electrical conduction. The Fermi level is a concept used to describe the probability of occupancy of energy levels by electrons at thermal equilibrium. In intrinsic semiconductors, the Fermi level is positioned at the midpoint of the energy gap at absolute zero. When...
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The semiconductor's...
Carrier Transport01:21

Carrier Transport

The generation of electrical current in semiconductors is fundamentally driven by two mechanisms: drift and diffusion. These processes are essential for the functionality and performance of semiconductor-based devices.
Drift Current:
The drift of charge carriers is started by an external electric field (E). Charged particles, such as electrons and holes, experience an acceleration between collisions with lattice atoms. For electrons, this results in a drift velocity (vd) given by:
Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
Carrier Generation and Recombination01:22

Carrier Generation and Recombination

Carrier generation is the process by which electron-hole pairs (EHPs) are created within the semiconductor. In direct-bandgap semiconductors, such as gallium arsenide (GaAs), this occurs efficiently when energy absorption prompts valence electrons to leap into the conduction band, leaving behind holes.
This process is given by the generation rate G and is efficient due to the conservation of momentum between the valence band maximum and conduction band minimum.
Indirect generation involves an...

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Related Experiment Video

Updated: Jul 13, 2026

Using Laser Scanning Microscopy to Determine Electromigration in Molybdenum Disilicide
09:41

Using Laser Scanning Microscopy to Determine Electromigration in Molybdenum Disilicide

Published on: May 23, 2025

Monovacancy and interstitial migration in ion-implanted silicon.

P G Coleman1, C P Burrows

  • 1Department of Physics, University of Bath, Bath BA2 7AY, United Kingdom.

Physical Review Letters
|August 7, 2007
PubMed
Summary
This summary is machine-generated.

This study observed monovacancy and self-interstitial migration in ion-implanted silicon using positron annihilation spectroscopy. Activation energies for migration were measured, revealing insights into defect behavior in doped silicon.

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3D Depth Profile Reconstruction of Segregated Impurities Using Secondary Ion Mass Spectrometry
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3D Depth Profile Reconstruction of Segregated Impurities Using Secondary Ion Mass Spectrometry
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3D Depth Profile Reconstruction of Segregated Impurities Using Secondary Ion Mass Spectrometry

Published on: April 29, 2020

Area of Science:

  • Materials Science
  • Solid-State Physics
  • Semiconductor Physics

Background:

  • Ion implantation creates point defects like vacancies and interstitials in silicon.
  • Understanding defect migration is crucial for semiconductor device performance and reliability.
  • Float-zone silicon is a high-purity material used in advanced electronic applications.

Purpose of the Study:

  • To investigate the migration behavior of monovacancies (V0) and self-interstitials (I) in ion-implanted silicon.
  • To determine the activation energies for the migration of these point defects.
  • To explore the influence of arsenic doping on defect annihilation mechanisms.

Main Methods:

  • Variable-energy positron annihilation spectroscopy (VEPAS) was employed to detect and characterize vacancies.
  • In situ implantation of helium ions at low temperatures (below 50 K) was used to create V0 and I.
  • Isothermal heating experiments were conducted to monitor defect evolution over time.

Main Results:

  • The activation energies for self-interstitial (I) and monovacancy (V0) migration were determined to be 0.078(7) eV and 0.46(28) eV, respectively.
  • In highly As-doped silicon, vacancies were partially annihilated by mobile interstitials.
  • A secondary annealing stage above room temperature in As-doped silicon suggests the involvement of vacancy-dopant complexes (V-As).

Conclusions:

  • The study successfully quantified the migration parameters of key point defects in silicon.
  • Arsenic doping influences defect dynamics, leading to complex annealing behaviors.
  • The findings contribute to a deeper understanding of defect engineering in semiconductor materials.