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Updated: Jul 13, 2026

Stress Distribution During Cold Compression of Rocks and Mineral Aggregates Using Synchrotron-based X-Ray Diffraction
Published on: May 20, 2018
Thin film compressive stresses due to adatom insertion into grain boundaries
Chun-Wei Pao1, Stephen M Foiles, Edmund B Webb
1Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, New Jersey 08544, USA.
Abstract:
Atomic simulations of the growth of polycrystalline Ni demonstrate that deposited atoms incorporate into the film at boundaries, resulting in compressive stress generation. Incorporated atoms can also leave the boundaries and thus relieve compressive stress. This leads to a complex interplay between growth stress, adatom incorporation, and surface structure. A simple, theoretical model that accounts for grain size effects is proposed and is in good agreement with simulation results.
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