Temperature change, dentinal fluid flow and cuspal displacement during resin composite restoration

Dentin-bonding agents and resin composite materials typically require light activation for polymerization. Light curing generates heat, which may influence dentinal fluid flow (DFF) and cuspal displacement. This study investigated the relationship among temperature increase, DFF and cuspal displacement in extracted human maxillary premolars with a mesial occlusal distal (MOD) cavity preparation. Two types of curing light were compared. Temperature changes were measured using thermocouples located on the occlusal cavity floor and at the pulp-dentine junction, during polymerization of bonding agent and resin composite material. DFF and cuspal displacement were measured simultaneously using automated flow measurement apparatus and direct current differential transformers respectively. Temperature increases of up to 15 degrees C were recorded during the restoration procedures. A quartz tungsten halogen (QTH) unit produced a significantly greater temperature increase than a light-emitting diode unit and curing of the bonding agent generated less temperature increase than curing of the resin composite. Heating due to exothermic reaction during polymerization of bonding agent and resin was not significantly different between light sources or between bonding and curing (P > 0.05). The QTH unit produced both greater inward fluid flow and cuspal displacement during the irradiation of bonding agent and resin composite than the light-emitting diode unit. There was not a simple relationship between temperature increase, fluid movement and cuspal displacement. From a clinical point of view, the light-emitting diode unit can be considered preferable to the QTH light, because it caused significantly smaller temperature increase, fluid shift and cuspal displacement.