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Updated: Jul 10, 2026

Planar and Three-Dimensional Printing of Conductive Inks
Published on: December 9, 2011
Application of microcontact printing to electroless plating for the fabrication of microscale silver patterns on
Chih-Hao Hsu1, Ming-Chih Yeh, Kung-Lung Lo
1Department of Chemical Engineering, National Taiwan University, Taipei, Taiwan.
Abstract:
Microcontact printing (microCP) and electroless plating are combined to produce microscale patterns of silver on glass substrates. Silver patterns with feature sizes of 0.6-10 microm stripes are fabricated using two methods. (1) The printing seeding layer (PSL) method is to apply microCP to directly print the catalyst Sn pattern for further electroless plating. (2) The printing masking layer (PML) method is to use microCP to print the octadecyltrichlorosilane (OTS) self-assembled monolayer as a masking layer on glass substrates, which then become Sn-activated in the unstamped regions by immersing the substrates in stannous chloride solution. After the electroless silver plating, the PML method has a better selectivity of silver deposition than the PSL method. In addition, variation of the deposited silver thickness as a function of the plating time and temperature is discussed.

