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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging
T Tokuda1, M Kawada, S Sugitani
1Nara Inst. of Sci. & Technol., Nara, Japan. tokuda@ms.naist.jp
Abstract:
In the present work, we designed a multi-chip-architecture based flexible neural stimulation device for retinal prosthesis. Based on the multi-chip architecture, a novel CMOS stimulation device was successfully designed and characterized. A packaging technique for thin, flexible neural stimulation device was also proposed and demonstrated. Flip-chip bonding technology plays an essential role in the fabrication of the present thin and flexible neural stimulation device.
