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Updated: Jul 10, 2026

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A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles
Published on: March 13, 2017
Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer.
F Axisa1, D Brosteaux, E De Leersnyder
1IMEC/TFCG Microsystems, Ghent, Belgium. Fabrice.Axisa@elis.UGent.be
Summary
Molded Interconnect Device technology enables highly stretchable electronic circuits for wearable and implantable applications. This innovation achieves over 100% stretchability with enhanced reliability using conductive polymers.
Area of Science:
- Materials Science
- Electrical Engineering
- Biomedical Engineering
Background:
- Electronic circuits for human implantation or smart clothing require soft, stretchable, and elastic properties for user comfort.
- Existing technologies often lack the necessary flexibility and durability for such demanding applications.
Purpose of the Study:
- To present the feasibility of functional stretchable electronic circuits using Molded Interconnect Device (MID) technology.
- To demonstrate a cost-effective and reliable method for creating stretchable electronics.
Main Methods:
- Interconnecting rigid or flexible standard components using meander-shaped metallic wires.
- Embedding these interconnected components within a stretchable substrate polymer using molding techniques.
- Developing and applying advanced technologies to ensure low cost and high reliability under mechanical strain.
Main Results:
- Demonstrated reliable stretchability of the developed electronic circuits exceeding 100%.
- Achieved enhanced reliability through the incorporation of an additional conductive polymer layer.
- Validated the feasibility of MID technology for producing functional stretchable electronic circuits.
Conclusions:
- Molded Interconnect Device technology offers a viable solution for creating highly stretchable and reliable electronic circuits.
- The developed methods provide a cost-effective approach for stretchable electronics suitable for wearable and implantable devices.
- Further enhancements in reliability can be achieved with conductive polymer integration.

