Annealing characteristics of nanostructured Cu-Fe-P alloy processed by accumulative roll-bonding

Annealing characteristics of a nanostructured copper alloy processed by accumulative roll-bonding (ARB) were studied. A nano-grained Cu-Fe-P alloy processed by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 400 degrees C for 0.6 ks. The sample still showed an ultrafine grained (UFG) structure up to 250 degrees C, however above 300 degrees C it began to replace by equiaxed and coarse grains due to an occurrence of the conventional static recrystallization. The hardness of the annealed copper decreased largely above 300 degrees C. These annealing characteristics of the UFG copper alloy were compared to those of a high purity copper.