Nanostructured bulk copper fabricated by accumulative roll bonding.

Naoki Takata1, Seong-Hee Lee, Cha-Yong Lim

  • 1Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan.

Summary

Severe plastic deformation via accumulative roll-bonding (ARB) created nanostructured copper alloys with enhanced strength. This process refined microstructures, significantly boosting tensile strength while maintaining ductility.

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