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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Speed and energy analysis of digital interconnections: comparison of on-chip, off-chip, and free-space technologies

G I Yayla, P J Marchand, S C Esener

    Applied Optics
    |February 13, 2008
    PubMed

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