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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers

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A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon

Wee Kiong Choi1, Tze Haw Liew, Han Guan Chew

  • 1Microelectronics Laboratory, Department of Electrical and Computer Engineering, National University of Singapore, 117576 Singapore, Singapore. elechoi@nus.edu.sg

Small (Weinheim an Der Bergstrasse, Germany)
|February 15, 2008
PubMed
Abstract

No abstract available in PubMed .

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