Phenolic molding compound filled with nonmetals of waste PCBs

Nonmetals reclaimed from waste phenolic cellulose paper printed circuit boards (PCBs) are used to replace wood flour in the production of phenolic molding compound (PMC). The results indicate that filling of nonmetals in PMC improves the charpy notched impact strength and heat deflection temperature (HDT) and reduces flexural strength and rasching fluidity. Rasching fluidity decreases dramatically with the increase of the content of nonmetals. To ensure sufficient properties of PMC, the optimal added content of nonmetals is 20 wt %, which results in a flexural strength of 70 MPa, a charpy notched impact strength of 2.4 KJ/m2, a HDT of 168 degrees C, a dielectric strength of 3.9 MV/m, and a rasching fluidity of 103 mm, all of which meet the national standard data. When the added content of nonmetals is 20%, the charpy notched impact strength, HDT, and rasching fluidity of PMC decrease, and the flexural and dielectric strengths decrease at first and then increase with decreasing particle sizes. All the results indicate that making PMC with nonmetals of waste PCBs can resolve environmental pollution, reuse nonmetals in different fields, and provide a new method for resource utilization of nonmetals from waste PCBs.