Thin-film induced effects on the stability of SAW devices

Measurements show an upward shift on the order of 50 ppm in the resonant frequency of a surface acoustic wave (SAW) resonator, as taken before and after the device is hermetically sealed in vacuum following a certain glass-frit sealing process. The authors analyze some of the thin-film phenomena that are potential sources of the observed frequency shift and that may affect the long-term stability of such devices. Various factors contributing to the shifts include: 1) intrinsic or structural stresses in the bonding layers as well as in the interdigital transducer (IDT) fingers; 2) thermal stresses due to the differences in thermal expansion coefficients of the metallic IDT fingers and the bonding agent (glass frits) from those of quartz; 3) partial oxidation of the IDT fingers and transmission lines during the frit glazing process; and 4) possible metal diffusion into quartz. Quantitative estimates of the contribution of two factors to the total observed frequency shift after a certain glass-frit sealing process are provided. Rough estimates of the frequency shifts due to the oxidized film are made from the dispersion curves for a uniform thin aluminum film and for its oxide film as fully plated on a quartz substrate. It is concluded that the results may provide a way of estimating the magnitude of the intrinsic stress for a given long-term stability of the SAW device.