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Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments
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Application of modulation measurement profilometry to objects with surface holes.

L Su1, X Su, W Li

  • 1Department of Opto-Electronics, Sichuan University, Chengdu, 610064, China. nic5701@pridns.scuu.edu.cn

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|February 29, 2008
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Modulation measurement profilometry (MMP) offers a novel 3D surface measurement technique. This method effectively measures objects with holes, overcoming limitations of traditional profilometry methods.

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Area of Science:

  • Optics and Photonics
  • Metrology
  • Surface Science

Background:

  • Conventional 3D profilometry methods like structured light triangulation face challenges with complex geometries.
  • Phase measurement profilometry and Fourier transform profilometry struggle with shadows and spatial discontinuities.

Purpose of the Study:

  • To detail the application of Modulation Measurement Profilometry (MMP) for measuring objects with surface holes.
  • To demonstrate MMP's advantages over conventional 3D profilometry techniques.

Main Methods:

  • MMP utilizes modulation measurements instead of structured light triangulation.
  • It employs perpendicular projection, aligning the CCD camera and projecting light.
  • Wrapped phase calculations are not required, simplifying the process.

Main Results:

  • MMP successfully measured a wheellike object (31.5 mm thick, 80 mm outer diameter, 20 mm inner diameter), including its internal hole.
  • The method captured all visible surfaces, demonstrating its capability for complex geometries.
  • Experimental results confirmed MMP's utility for 3D profilometry.

Conclusions:

  • MMP is a robust technique for 3D surface measurement, particularly for objects with holes.
  • It effectively addresses limitations of existing methods concerning shadows and discontinuities.
  • MMP shows significant potential for measuring objects with discontinuous height steps and spatial isolation.