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Free-space parallel multichip interconnection system.

X Zheng1, P J Marchand, D Huang

  • 1Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, California 92093-0407, USA. xzheng@ece.ucsd.edu

Applied Optics
|March 20, 2008
PubMed
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This study demonstrates a novel free-space optics packaging for high-speed interchip communication. The modular approach offers a compact, scalable, and potentially low-cost solution for parallel optoelectronic interconnects.

Area of Science:

  • Optoelectronics
  • Packaging Engineering
  • Optical Communications

Background:

  • Traditional interchip communication faces limitations in speed and density.
  • Integrating optical interconnects with electronic multichip modules (MCMs) is challenging.
  • Developing cost-effective and scalable packaging solutions is crucial for advanced computing.

Purpose of the Study:

  • To present a proof-of-concept for a modular packaging approach using free-space optics for interchip communication.
  • To demonstrate the feasibility of integrating optical interconnect modules onto electronic MCMs.
  • To develop a potentially low-cost packaging solution using off-the-shelf components and passive assembly.

Main Methods:

  • Utilized a modified folded 4-f imaging system for optical interconnects.

Related Experiment Videos

  • Employed off-the-shelf optics, conventional electronic packaging, and passive assembly techniques.
  • Developed a prototype system with 48 free-space channels using eight laser and detector chips on a ceramic carrier alongside silicon complementary metal-oxide semiconductor chips.

    • Main Results:

    • Demonstrated parallel optoelectronic (OE) free-space interconnections at a speed of 200 MHz.
    • Achieved a compact system volume of approximately 164 cm³.
    • The prototype supports 48 independent channels with potential for scalability to higher densities and additional chips.

    Conclusions:

    • The proposed modular packaging approach is feasible for high-speed interchip communication.
    • The system offers a compact, scalable, and potentially low-cost solution for free-space optical interconnects.
    • This technology can accommodate increased interconnection density through 2D OE device arrays and additional modules.