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Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards
1Integrated Optical Module Laboratory, Korea Photonics Technology Institute, Gwangju 500-460, Korea.
Optics Express
|June 12, 2008
Summary
A novel rigid flexible optical electrical printed circuit board (RFOE-PCB) offers universal optical interconnection for chips and boards. This easily installed RFOE-PCB demonstrated successful 2.5-Gb/s data transmission.
Area of Science:
- Optoelectronics
- Materials Science
- Electrical Engineering
Background:
- Traditional optical interconnections face challenges in integration and versatility.
- The demand for high-speed, reliable optical links at chip and board levels is increasing.
Purpose of the Study:
- To propose and characterize a new optical interconnection scheme using a rigid flexible optical electrical printed circuit board (RFOE-PCB).
- To demonstrate the applicability and performance of the RFOE-PCB for optical data transmission.
Main Methods:
- Fabrication of the RFOE-PCB.
- Characterization of optical properties and heat resistance.
- Demonstration of data transmission using an embedded optical waveguide.
Main Results:
- The RFOE-PCB was successfully fabricated.
- The optical and heat-resisting properties were evaluated.
- A 2.5-Gb/s data transmission was achieved through a 45-degree-ended optical waveguide within the RFOE-PCB.
Conclusions:
- The RFOE-PCB provides a viable and versatile solution for optical interconnections.
- The proposed scheme is suitable for both chip- and board-level applications.
- The RFOE-PCB exhibits promising performance for high-speed optical data transmission.
