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Widefield subsurface microscopy of integrated circuits.

Fatih Hakan Köklü1, Justin I Quesnel, Anthony N Vamivakas

  • 1Department of Physics and Electrical and Computer Engineering and the Photonics Center, Boston University, 8 Saint Mary's Street, Boston, Massachusetts 02215, USA. hakan@bu.edu

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Summary

We used a numerical aperture increasing lens technique for widefield subsurface imaging of silicon integrated circuits. This method significantly improves lateral and longitudinal resolution for backside imaging beyond conventional limits.

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Area of Science:

  • Optics and Photonics
  • Materials Science
  • Semiconductor Device Analysis

Background:

  • Subsurface imaging of silicon integrated circuits is crucial for failure analysis and quality control.
  • Conventional backside imaging techniques face limitations in achieving high spatial resolution.
  • Advanced microscopy methods are needed to overcome diffraction limits in integrated circuit analysis.

Purpose of the Study:

  • To apply the numerical aperture increasing lens (NAIL) technique to widefield subsurface imaging of silicon integrated circuits.
  • To demonstrate enhanced lateral and longitudinal resolutions for backside imaging.
  • To compare the spatial resolution of widefield and confocal microscopy for integrated circuit analysis.

Main Methods:

  • Utilized a numerical aperture increasing lens technique with a simple infrared widefield microscope (wavelength = 1.2 microm).
  • Performed backside imaging through the silicon substrate of integrated circuits.
  • Conducted a comparative analysis of spatial resolution between widefield and confocal microscopy.

Main Results:

  • Achieved a lateral spatial resolution of 0.26 microm (0.22 lambda(0)).
  • Demonstrated a longitudinal resolution of 1.24 microm (1.03 lambda(0)).
  • Showcased resolutions significantly exceeding conventional backside imaging capabilities.

Conclusions:

  • The NAIL technique offers a powerful approach for high-resolution subsurface imaging of silicon integrated circuits.
  • This method surpasses the resolution limits of traditional backside imaging.
  • Widefield microscopy with NAIL provides a valuable alternative for integrated circuit analysis, complementing confocal microscopy.