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Updated: Jul 3, 2026

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A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires
Published on: January 21, 2016
Controlled buckling of semiconductor nanoribbons for stretchable electronics
Yugang Sun1, Won Mook Choi, Hanqing Jiang
1Department of Materials Science and Engineering, Beckman Institute, and Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, Illinois 61801, USA. ygsun@anl.gov
Nature Nanotechnology
|July 26, 2008
Summary
Researchers developed a mechanical method to create 3D semiconductor nanoribbon shapes. This technique enables highly stretchable and bendable electronics and optoelectronics.
Area of Science:
- Materials Science and Engineering
- Nanotechnology
- Solid-State Physics
Background:
- Precise control over semiconductor nanostructure geometry is crucial for advanced applications.
- Existing methods for creating complex 3D nanostructures are often limited or challenging.
Purpose of the Study:
- To introduce a novel mechanical strategy for fabricating complex 3D shapes in semiconductor nanoribbons.
- To demonstrate the potential of these structures for creating highly deformable electronic and optoelectronic devices.
Main Methods:
- Utilized lithographically patterned surface chemistry to define adhesion sites.
- Employed elastic substrate deformations to induce controlled local displacements in nanoribbons.
- Applied analytical models to quantitatively describe the resulting buckling geometries.
Main Results:
- Successfully created precisely engineered buckling geometries in gallium arsenide (GaAs) and silicon (Si) nanoribbons.
- Demonstrated that these 3D nanoribbon structures can achieve extreme stretchability (up to ~100%) and compressibility (up to ~25%).
- Showcased high bendability with achievable curvature radii as small as ~5 mm.
Conclusions:
- The reported mechanical strategy offers a versatile route to complex 3D nanoribbon configurations.
- These engineered nanostructures pave the way for next-generation stretchable, compressible, and bendable electronics and optoelectronics.

