Metal-Semiconductor Junctions
Biasing of Metal-Semiconductor Junctions
Bonding in Metals
Metal-Ligand Bonds
Properties of Organometallic Compounds
Theory of Metallic Conduction
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Makusu Tsutsui1, Masateru Taniguchi, Tomoji Kawai
1The Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan.
Researchers developed a nanoscale thermometer to measure heat in molecular junctions. This technique revealed significant heating (463 K) and identified heat generation mechanisms, crucial for electrical device durability.
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