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Updated: Jun 29, 2026

Quantification of Metal Leaching in Immobilized Metal Affinity Chromatography
Published on: January 17, 2020
[Leaching behavior of heavy metal elements in lead-free solders]
Jie Zhao1, Xian-ming Meng, Chen Chen
1State Key Laboratory of Materials Modification, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116023, China. jiezhao@dlut.edu.cn
Abstract:
Leaching behavior of heavy metal elements from Sn-3.5 Ag-0.5 Cu, Sn-3.5 Ag, Sn-0.5 Cu lead-free solders and their joints were investigated in typical acid, alkaline and saline corrosion solutions. It is found that for solder alloys, significant leaching of Sn was observed in NaCl saline solution, about two orders of magnitude higher than that in acid and alkaline solution. However, in the case of solder joints, more leaching of Sn was observed in acid solution from Sn-3.5 Ag/Cu and Sn-0.5 Cu/Cu joints, and in NaOH alkaline solution for Sn-3.5 Ag - 0.5 Cu joint.
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