Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor.

Serena H Wong1, Mario Kupnik, Xuefeng Zhuang

  • 1Edward L Ginzton Laboratory, Stanford University, Stanford, CA, USA. hwong@stanford.edu

Summary

Optimizing capacitive micromachined ultrasonic transducer (CMUT) fill factor is key for performance. Reducing cell spacing can cause issues, but wider support posts and aspect ratio adjustments improve reliability and operational modes.

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