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Related Experiment Video

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Building Langmuir Probes and Emissive Probes for Plasma Potential Measurements in Low Pressure, Low Temperature Plasmas

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Three point method to characterize low-pressure electronegative discharges using electrostatic probe.

S Y Kang¹, T H Chung, K-S Chung

¹Department of Physics, Dong-A University, Busan 604-714, Republic of Korea.

The Review of Scientific Instruments

|February 5, 2009

Summary

This study measures charged particle densities and electron temperatures in sulfur hexafluoride (SF6) plasmas using electrostatic probes. Results reveal how plasma properties vary with pressure and power, crucial for industrial applications.

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Area of Science:

Plasma Physics
Materials Science

Background:

Inductively coupled plasmas (ICPs) are vital in semiconductor manufacturing.
Sulfur hexafluoride (SF6) is a common plasma gas, but its behavior is complex due to negative ion formation.

Purpose of the Study:

To investigate the plasma characteristics of low-pressure inductively coupled SF6 plasmas.
To determine the influence of pressure and power on charged species densities and electron temperature.

Main Methods:

Utilized electrostatic probe measurements to obtain current-voltage (I-V) characteristics.
Calculated positive ion density using orbital-motion-limited theory.
Determined electron temperature from I-V curve slopes and electron energy distribution functions (EEDFs).
Deduced electronegativity and negative ion density from parameter ratios across pressure points.

Main Results:

Measured electron temperature and saturation currents for positive ions and electrons.
Quantified variations in positive ion density, negative ion density, and electronegativity with pressure and power.
Observed changes in electron temperature as a function of pressure and power.

Conclusions:

Electrostatic probes effectively characterize SF6 plasmas.
Plasma parameters like charged species density and electron temperature are sensitive to pressure and power variations.
Understanding these variations is key for optimizing SF6-based plasma processes.