Related Experiment Video
Updated: Jun 25, 2026

The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements
Published on: December 5, 2025
Heterodyne lock-in thermal coupling measurements in integrated circuits: Applications to test and characterization
J Altet1, E Aldrete-Vidrio, D Mateo
1Department of Electronic Engineering, Universitat Politècnica de Catalunya, C/. Jordi Girona 1-3,Campus Nord UPC, 08034 Barcelona, Spain.
Abstract:
Heterodyne strategies can be used to characterize thermal coupling in integrated circuits when the electrical bandwidth of the dissipating circuit is beyond the bandwidth of the thermal coupling mechanism. From the characterization of the thermal coupling, two possible applications are described: extraction of characteristics of the dissipating circuit (the determination of the center frequency of a low-noise amplifier) and the extraction of the thermal coupling transfer function.
Related Concept Videos
Biasing of Metal-Semiconductor Junctions
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
Double Resonance Techniques: Overview
Spin decoupling is usually achieved by...
Biasing of FET
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the gate...
Operational Amplifiers
Instrumentation Amplifier
To overcome this challenge, an ECG machine utilizes an instrumentation amplifier. This specialized amplifier is...
Integrator and Differentiator
An integrator within an op-amp circuit produces an output directly proportional to the integral of the input signal. This is achieved by replacing the feedback resistor in a typical inverting...

