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Updated: Jun 24, 2026

Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices
Published on: December 7, 2017
Integratable nanowire transistors.
Nathaniel J Quitoriano1, Theodore I Kamins
1Information and Quantum Systems Laboratory, Hewlett-Packard Laboratories, Palo Alto, California 94304, USA. nateq@hp.com
We developed a novel structure for controlled nanowire growth, enabling the fabrication of high-performance top-gated metal-oxide-semiconductor field-effect transistors (MOSFETs) with excellent on/off ratios.
Area of Science:
- Nanotechnology
- Materials Science
- Semiconductor Physics
Background:
- Precise control over nanowire growth is crucial for advanced semiconductor devices.
- Existing methods often lack the ability to dictate both location and direction of nanowire growth.
- Silicon-on-insulator (SOI) substrates are widely used in microelectronics fabrication.
Purpose of the Study:
- To engineer a structure that controls nanowire location and growth direction.
- To demonstrate the fabrication of top-gated metal-oxide-semiconductor field-effect transistors (MOSFETs) using this controlled growth structure.
- To characterize the performance of the fabricated MOSFETs.
Main Methods:
- Engineered a specific structure to guide nanowire growth against an oxide surface.
- Utilized a (001) silicon-on-insulator substrate for device fabrication.
- Grew nanowires in specific crystallographic directions, primarily (110).
Main Results:
- Achieved controlled nanowire growth in terms of location and direction.
- Fabricated top-gated MOSFETs with high performance.
- Demonstrated an impressive Io/Ioff ratio of approximately 10^4.
- Obtained a subthreshold slope of approximately 155 mV/decade.
Conclusions:
- The developed structure effectively controls nanowire growth for device applications.
- The fabricated MOSFETs exhibit excellent electrical characteristics, suitable for integrated circuits.
- Nanowire growth, even when directed, incorporates specific crystallographic planes ({111}) during the addition process.
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