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Updated: Jun 22, 2026

A Technique to Functionalize and Self-assemble Macroscopic Nanoparticle-ligand Monolayer Films onto Template-free Substrates
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Ti/Al nanolayered thin films.

A S Ramos1, M T Vieira, C Serra

  • 1ICEMS, Departamento de Engenharia Mecânica, Faculdade de Ciências e Tecnologia, Universidade de Coimbra, R. Luís Reis Santos, 3030-788 Coimbra, Portugal.

Journal of Nanoscience and Nanotechnology
|June 10, 2009
PubMed
Summary
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Titanium/Aluminum (Ti/Al) multilayer thin films were created using magnetron sputtering. Nanoscale characterization confirmed a layered structure with grain size dependent on modulation period, showing interface intermixing.

Area of Science:

  • Materials Science
  • Nanotechnology
  • Thin Film Technology

Background:

  • Multilayer thin films are crucial for various applications.
  • Understanding nanoscale properties of Titanium/Aluminum (Ti/Al) multilayers is essential.
  • Magnetron sputtering is a key technique for depositing advanced thin films.

Purpose of the Study:

  • To characterize Ti/Al multilayer thin films at the nanoscale.
  • To investigate the effect of modulation period on film structure and interfaces.
  • To analyze the influence of deposition parameters on film properties.

Main Methods:

  • Magnetron sputtering deposition of Ti/Al multilayers onto stainless steel.
  • Time-of-flight secondary ion mass spectroscopy (ToF-SIMS) for elemental and interface analysis.

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  • X-ray diffraction (XRD) and transmission electron microscopy (TEM) for structural characterization.

    • Main Results:

    • Successfully fabricated Ti/Al multilayers with modulation periods up to 100 nm.
    • Confirmed nanometric multilayer structure with identifiable elemental Ti and Al, even at 4 nm periods.
    • Observed that grain size correlates with the multilayer modulation period.
    • Detected interface intermixing during deposition, decreasing with smaller modulation periods.
    • No intermetallic compounds were found in the as-deposited state.

    Conclusions:

    • The magnetron sputtering process yields well-defined nanometric Ti/Al multilayer structures.
    • Interface intermixing is an inherent aspect of the deposition process, influenced by modulation period.
    • The observed intermixing may affect the subsequent exothermic reaction between Ti and Al.