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Integration of active and passive polymer optics
Optics Express
|June 18, 2009
Summary
We developed a wafer-scale fabrication process for polymer lasers and waveguides. This method achieves high yield and precise wavelength control, enabling on-chip polymer sensor systems.
Area of Science:
- Materials Science
- Optoelectronics
- Nanotechnology
Background:
- Integration of active and passive polymer optics is crucial for advanced photonic devices.
- Existing fabrication methods face challenges in scalability and precision for polymer-based systems.
Purpose of the Study:
- To demonstrate a wafer-scale fabrication process for integrating polymer distributed feedback (DFB) lasers and waveguides.
- To achieve high yield and precise control over laser emission wavelengths for on-chip applications.
Main Methods:
- Combined nanoimprint and photolithography (CNP) using a UV-transparent stamp with nanoscale protrusions and a metal shadow mask.
- Embossing UV-transparent mask/nanoimprint stamp into softened resist, followed by UV exposure for feature definition.
- Integration of polymer dye DFB lasers with undoped SU-8 polymer waveguides.
Main Results:
- Wafer-scale fabrication process achieved a yield exceeding 90%.
- Emission wavelengths were reproduced within a 2 nm tolerance.
- Demonstrated light confinement on-chip and investigated environmental influences (temperature, refractive index) on laser wavelength.
Conclusions:
- The CNP method provides a scalable and high-yield fabrication route for polymer DFB lasers and waveguides.
- The demonstrated process is suitable for developing on-chip polymer sensor systems due to wavelength sensitivity to environmental changes.
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