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Electrochemical Roughening of Thin-Film Platinum Macro and Microelectrodes
Published on: June 30, 2019
Chemical and morphological changes on platinum microelectrode surfaces in AC and DC fields with biological buffer
Aytug Gencoglu1, Adrienne Minerick
1Dave C. Swalm School of Chemical Engineering, Mississippi State University, Mississippi State 39762, USA.
Lab on a Chip
|June 18, 2009
Summary
Platinum microelectrodes degrade in electric fields, impacting electrokinetic microdevices. Surface changes like dissolution and oxidation occur, affecting device performance and reproducibility.
Area of Science:
- Electrochemistry
- Materials Science
- Microfluidics
Background:
- Platinum is commonly used for microelectrodes in electrokinetic microdevices due to its perceived inertness.
- Inconsistent reproducibility in cellular electrokinetic microdevice responses suggests issues with platinum microelectrode function over time.
Purpose of the Study:
- To investigate chemical and morphological changes on platinum microelectrode surfaces.
- To assess the impact of different electric field conditions (AC and DC) and buffer solutions on platinum microelectrodes.
Main Methods:
- Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were used to analyze surface changes.
- Cyclic voltammetry (CV) and X-ray photoelectron spectroscopy (XPS) were employed to verify and characterize platinum surface alterations.
Main Results:
- Observed platinum dissolution, redeposition, chloride, and oxide formation on microelectrode surfaces.
- Surface changes were more pronounced under higher AC electric fields and DC electric fields compared to lower AC fields.
- XPS confirmed the presence of oxygen and platinum oxidation on the electrode surfaces.
Conclusions:
- Platinum microelectrodes are not inert and undergo significant chemical and morphological changes when exposed to electric fields in biological buffer solutions.
- These changes can compromise the reliability and reproducibility of electrokinetic microdevices.
- Further research is needed to develop more stable electrode materials or protective strategies for microdevice applications.
