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Integrated GHz silicon photonic interconnect with micrometer-scale modulators and detectors
Long Chen1, Kyle Preston, Sasikanth Manipatruni
1School of Electrical and Computer Engineering, Cornell University, Ithaca, NY 14853, USA. lc286@cornell.edu
Optics Express
|August 19, 2009
Summary
We developed a compact silicon optical link for high-speed data transmission. This technology enables low-power, on-chip optical interconnects, crucial for future microprocessors.
Area of Science:
- Photonics
- Materials Science
- Electrical Engineering
Background:
- On-chip optical interconnects are crucial for high-performance computing.
- Existing solutions face challenges in power consumption and scalability.
Purpose of the Study:
- To demonstrate a compact and low-power monolithic optical link on silicon.
- To achieve high-speed data transmission for future microprocessors.
Main Methods:
- Utilized micrometer-scale ring-resonator enhanced silicon modulators.
- Integrated waveguide-coupled germanium photodetectors.
- Achieved 3 Gbps operation with low voltage swing and bias.
Main Results:
- Demonstrated a 3 Gbps optical link on silicon.
- Achieved low power consumption of approximately 120 fJ/bit.
- Utilized ring-resonator enhanced modulators and germanium photodetectors.
Conclusions:
- The developed optical link is a significant advancement for on-chip optical interconnects.
- This technology paves the way for scalable and energy-efficient optical networks in future microprocessors.
