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Updated: Jun 18, 2026

Synthesis of Bimetallic Pt/Sn-based Nanoparticles in Ionic Liquids
Published on: August 23, 2018
Catalytic behavior of Sn/Bi metal powder in anhydride-based epoxy curing
Keon-Soo Jang1, Yong-Sung Eom, Jong-Tae Moon
1Electronics and Telecommunications Research Institute, 138 Gajeongno, Yuseong-gu, Daejeon 305-700, Republic of Korea.
Abstract:
In this paper, we report the catalytic activity of the Sn/Bi alloy beads and its acceleration of the exothermic epoxy curing reactions in various thermal conditions and bead compositions. As being used as low-melting solder balls in electronic interconnection processes with various epoxy systems, it was found that the Sn/Bi beads substantially lowered the exothermic peak temperature of the diglycidyl ether of bisphenol A (DGEBA)/anhydride systems in up to ca. 140 degrees C depending on different types of anhydride curing agents. The catalytic activation of Sn/Bi powder was initiated with a small amount of Sn/Bi powder, for example, lowering ca. 50 degrees C of the exothermic peak temperature by adding only 0.1 vol% of Sn/Bi powder. The catalytic capability of the powder was increased by using smaller sized beads corresponding to larger catalytic surface area at the same volume fraction. Exhibiting a latent catalytic effect, the catalytic activity of Sn/Bi powder was remained latent at temperatures lower than 100 degrees C in isothermal conditions.
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